The FX-940 automated optical inspection system offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.
- Megapixel color imaging
- Capture on the fly technology
- 1 top-down & 4 side angle cameras
- Quick set-up
- High speed
- High defect coverage / low false failure rate
- Optional 3D inspection
Nordson YESTECH’s advanced 9 megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing
camera and four side viewing cameras, the FX-940 automated optical inspection system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
Programming the FX-940 AOI system is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The FX-940 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.
Advanced Fusion Lighting and newly available 9 megapixel image processing technology integrates several techniques, including color inspection, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.
Configurable for all line positions, the FX-940 automated optical inspection system is equally effective for paste, pre / post-reflow and final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.